Surface mount

The surface-mount technology used for producing electronic circuits and electronics includes:

• Analysis of the project and customer’s documentation
• Technological preparation – developing metal stencil, preparing documentation and mounting programmes.
• Screening of solder paste on the printed circuit boards
• Automatic SMD mount by automated machines.
• Manual SMD mount.
• Reflow soldering of print circuit boards on REFLOW machine.
• Inspection of the finished printed circuit boards and products.
• Labelling and traceability of products.
• Packaging and forwarding the finished products.

For these processes are used the following machines:

For small and medium series semi-automatic work station Fritsch Pick & Place – maximum board size – 300 х 400 mm, Thickness between 0.5 mm and 3.0 mm, minimum element – 0402, raster 0.50 mm.

For medium and big series the automatic machine for assembly of printed circuit boards and electronic elements Pick & Place PLM2000 - Productivity – 4000 components/hour, Work space 540 х 320 mm, minimum element – 0201,  raster 0.50 mm, Simultaneous feeding of up to 200 different components.

Semi-automatic Stencil printer EKRA-mat and DIMA with maximum size of the work space - 300 х 400 mm, board thickness between 0.5 mm and 3 mm.

Reflow soldering machine REFLOW – TWS 1380 AUTOMATION with 8 zones of air convection for lead and lead-free soldering of circuit boards and cooling zone.